solderable ends d2 d2=d1 0 0.20 0.5 0.1 0.5 0.1 4.9 0.2 2.6 0.15 d1 features plastic package has underwriters laboratories flammability classification 94v-0 glass passivated chip junction for surface mount applications high temperature metallurgically bonded construction mechanical data case: jedec do-213ab,molded plastic terminals: axial lead ,solderable per mil- std-750,method 2026 polarity: color band denotes cathode weight: 0.0046 ounces, 0.116 grams mounting position: any maximum ratings and electrical characteristics ratings at 25 ambient temperature unless otherwise specified. single phase,half wave,60 hz,resistive or inductive load. for capacitive load,derate current by 20%. gl 41b gl 41d gl 41g gl 41j gl 41k gl 41m gl 41t gl 41y units maximum recurrent peak reverse voltage 100 200 400 600 800 1000 1300 1600 v maximum rms voltage 70 140 280 420 560 700 910 1120 v maximum dc blocking voltage 100 200 400 600 800 1000 1300 1600 v maximum average forward rectified current (see fig.1) peak forward surge current 8.3ms single half-sine-wave superimposed on rated load (jedec method) maximum instantaneous forward voltage @1.0a v maximum reverse current @t a =25 at rated dc blocking voltage @t a =125 typical junction capacitance (note1) pf typical thermal resistance (note 2) /w operating junction temperature range storage temperature range note: 1. measured at 1.0mhz and applied reverse voltage of 4.0v dc. 2. thermal resistance from junction to ambient, 0.240.24"(6.06.0mm) copper pads to each terminal. 50 8.0 75 - 55 ---- +175 - 55 ---- +175 1.0 30 1.2 10 GL41A---gl41 y high temperature soldering guaranteed:450 /5 do - 213ab 1.1 voltage range : 50 --- 1000 v current: 1.0 a seconds at terminals.complete device sub-mersible cavity-free glass passivated junction surface mount rectifier s temperature of 265 for 10 seconds in solder bath c j t j t stg r ja v rrm v rms gl 41a 50 50 35 v dc a a i (av) i fsm a v f i r dimensions in millimeters diode semiconductor korea www.diode.kr
100 10 1 0 . 1 0 . 01 0 . 1 1 100 10 units mounted on 0.20x0.20''(5.0x5.0mm)x0.5mil inches(0.013mm) thick copperland areas t j =125 c o t j = 7 5 c o t j = 2 5 c o 1 000 1 0 . 1 0 . 01 10 100 80 0 20 40 60 1 0 0 resistive or inductive load 0.2x0.2(5.0x5.0mm) thick copperpand areas 0 0 25 50 0 . 2 0 . 4 0 . 6 0 . 8 1 . 2 1 . 0 1 50 75 100 1 25 200 1 7 5 average forward current,amperes peak forward surge current,amperes instantaneous forward current,amperes instantaneous reverse current microamperes gl 41 a - - - gl 41y fi g. 3 -- typi cal forward characteri sti cs fi g. 4 -- typi cal reverse characteri sti cs fi g. 5-typi cal juncti on capaci tance fi g. 1 -- forward derati ng curve fi g. 2 peak forward surge current n u m b e r o f c y c l e s a t 60 h z instantaneous forward voltage,volts percent of rated peak reverse voltage, fi g. 6-transi ent thermal i mpedance r e ve r s e v o l t a g e , v o l t s p u l se du r a ti o n , s ec a m b i e n t t e m p e r a t ur e junction capacitance pf transient thermal impedance, /w .2 2 1 .1 4 . 4 1 .0 2 40 10 20 60 1 0 0 41 0 2 04 0 1 00 f=1mhz t j =25 20 0 1 10 40 30 50 10 100 t j = t j max 8.3ms single half sine-wave y gl41k--gl41y GL41A--gl41j www.diode.kr diode semiconductor korea
|
